简述了电子元器件失效分析的常用技术手段和失效元器件的失效现象、失效模式、失效机理。对失效现场应收集的信息内容进行了介绍，并提出要注意的事项；对元器件的失效进行了分类——失效分为固有失效和使用失效，并对工程上的失效分布作了进一步的分析。最后，通过两个典型的工程实践事例，说明进行失效分析在工程上的应用和工程意义重大：失效分析能够改进和提高元器件制造单位的水平，也能够促进和提高元器件使用单位的设计水平。

This paper elucidates the usual technical means of the failure analysis of the electronic component and the failure phenomenon,failure mode and failure mechanism of failure electronic component.It introduces collecting information content on failure site,and advances cautionary items.It classifies the failure of the electronic component: indigenous failure,applied failure and does ulterior analyses of failure distribution on engineering.Finally,through the two typical examples of engineering practice,this paper explains the engineering application and engineering significance in failure analysis: the failure analysis can improve and heighten the level of the manufacturing unit,it can also promote and heighten the engineered level of the enduser.

TN710

致谢：在论文编写期间,得到了高级工程师黄碘主任的指导,在此表示衷心感谢!