机载、星载、舰载相控阵雷达由于其特定的使用环境，需要体积小、重量轻、高性能、高可靠、低成本的微波组件，带腔体LTCC基板具有高密度布线、电阻、电容、电感的内埋以及芯片的埋置等特性，是制作机载、星载、舰载相控阵雷警警波组件的理想的高密度基板。该文介绍了带腔体LTCC集成基板的制造技术，并对微带线、带状线、内埋电阻、腔体等关键技术进行了分析，提出了相应的解决方法。

For air-borne, satellite-borne and ship-borne phased array radars, the microwave modules with small size , lightweight, high performance and high reliability are needed because of their special environment. LTCC substrate with the properties of high density, embedded R/L/C and chips has become an ideal high density substrate for microwave modules. In this paper the manufacturing technology of LTCC substrate with cavity is introduced, the key manufacturing processes of microstrip line , stripline, embedded R and cavity are analysedt and the relevant solutions are suggested.

TN958.92