针对X波段T/R组件中的功率放大器芯片,建立芯片热模型,给出了获取器件热阻的公式和方法,并对功放芯片的等效热路进行了分析计算.文中给出了常用材料的热导率,对不同壳底材料,求出了在确保功放可靠工作下的系统最大热沉温度,从而为组件设计师优化组件成本提供了依据.最后提出了提高功率芯片可靠性的建议.

A chip thermal model is established for power amplifier in X-band T/R module in this paper.The method and formulas for obtaining thermal resistance are presented,analysis and calculation are carried out for equivalent chip thermal circuit.Thermal conductivities for materials commonly encountered in assemblies are presented.For different bottom material of the package,the maximum rated system heat sink temperature is calculated under condition of guaranteeing the power amplifier chip have reliable operating ...

TN722.75