提出一种基于低温共烧结陶瓷(LTCC)技术的封装形式,将声表面波滤波器(SAWF)做成表面贴装器件(SMD)。该 封装结构可实现SAWF基片表面上方2个换能器间的隔离,提高SAWF的阻带抑制,其器件适合于高密度组装,进而可演 变成SAWF集成在电路模块的LTCC多层电路板上,即直接将SAWF的裸基片掩埋在LTCC多层电路板内,实现器件—电 路一体化。

A package form based on low temperature co-fired ceramic(LTCC) is proposed in this paper, it is successful that the surface acoustic wave filter (SAWF) is made as surface mounted devices (SMD) . The SAWF substrate surface segregation between two transducers can be realized by the packaging structure for improving SAWF stopband rejection. The advantages of the device are suitable for high density assembly, and then SAWF is integrated into the LTCC multilayer circuit board of circuit module, the SAWF bare substrate is buried directly in LTCC multilayer circuit board for realizing device-circuit integration.