介绍一种机载电子设备机箱的热设计,使用IcePak软件对机箱内部空气流动情况进行仿真分析。分析结果表明:当风扇与模块之间的间距达到40 mm以上时,机箱内的流场分布趋于均匀。试验测试验证了仿真结果的正确性,该结论可以作为类似的电子设备机箱热设计的参考。

The paper introduces a thermal design of an airborne electronic equipment. The simulation analysis of the air flow in the cabinet is done using IcePak. It is shown that when the distance between the fan and the module is over 40 mm, the air flow is proper. The conclusion is proved by experiment. The conclusion can be used as reference in the thermal design of other similar airborne electronic equipment.