电子设备的功率器件和散热冷板之间由于存在面积差异,产生扩展热阻,在高热流密度条件下(>100 W/ cm2 )温升效应尤为明显。文中通过对固态T/ R组件冷板扩展热阻的简化近似解的分析计算,研究了冷板的导热系数、厚度、半径、对流换热系数等参数扩展热阻的影响规律,发现冷板存在厚度和半径的工程最优值使得扩展热阻或总热阻最小,建立了相应的尺寸优化准则,然后通过计算流体力学(computiatonal fluid dynamics,CFD)数值试验进行了计算验证,结果表明CFD解和简化解结果一致,研究结论可用于指导冷板或热扩展板的工程设计。

The spreading thermal resistance caused by the area difference between the electronic device and the cooling plate is significantly high when the heat flux density is higher than 100 W/ cm2 . In this paper, the thermal spreading resistance of the solid- state T/ R module cold plate was modeled and simulated with a simplified analytical method, and then the effect of heat transfer coefficient, thickness, radius, heat transfer coefficient of the cold plate was studied. The optimal combination of parameters, such as, the radius and the thickness was obtained, with which the spreading thermal resistance and the total heat transfer resistance was minimum. Finally, the present model was validated with a CFD simulation, with a reasonable match obtained, which proved the present work as a solid reference of relevant applications

TN607