针对铜合金馈线波导器件工艺过程中出现的电镀发黑、镀层不牢等难题,进行了大量工艺试验及低温钎焊工艺的优化研究。结果表明,镀层发黑的主要原因为焊缝结合率不高、致密性不够,电镀过程中的清洗液残留所导致。通过试验,得到了优化的馈线零部件低温钎焊工艺,并对焊接结构进行了改进,使钎焊质量能够满足产品的尺寸精度、电镀要求。

In order to meet the requirement of joining the waveguide of feeder system, technology of flame brazing and soldering were studied. By analysising the results of experiments using the technical parameter determined in this paper, the quality problem that the waveguide was black in some area was solved. Improved technology of brazing and soldering the waveguides can meet the needs of design.

TG439.1