提出了基于EDA 仿真技术的综合网络多层PCB 设计方法。借助EDA 仿真技术可以快速得到射频电路性能的计算结果,同时能够对PCB 板的信号完整性、电源完整性以及电磁兼容特性做出更精确的判断。该方法对于综合网络多层PCB 板的设计具有实用意义。

Design of multi-layer PCB for integrated network based on electronic design automation ( EDA) simulation technique is presented. The performance of RF circuit can be calculated conveniently, and the accuracy of signal integrity (SI) analysis, power integrity (PI) analysis and electromagnetic compatibility (EMC) will be found higher by using EDA tools. It has practical meaning for multi-layer PCB design.

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