随着功率芯片热耗和热流密度的不断提高,常规的深孔钻液冷冷板难以满足高热流密度芯片的散热需求。基于场协同原理,设计出一种菱形肋强化换热冷板,并和传统的深孔钻、微通道冷板进行了综合性能对比。仿真和试验研究表明:在同样总温差下,菱形肋冷板所需流量可低至深孔钻的1/3 以上;换热面积相当时,菱形肋冷板的总温差约为矩形肋(微通道)冷板的83%左右。

With the increase of heat dissipation and heat flux density of power chip, the conventional deep-hole drillling cooling plate can’t meet the cooling requirements of chip with high heat flux density. Based on field synergy principle, a new heat transfer enhancement cooling plate is designed with diamond pin-fin, which is compared with conventional deep-hole drillling and microchannel cooling plate. The simulation and experimental results show that the new cooling plate needs only 1/3 flow rate of the deep-hole drillling cooling plate to achieve its cooling performance. For the same heat exchange area, the total temperature difference of the new plate is about 83% f the micro-hannel cooling plate.

TN957