雷达、电子战等射频电子装备向高集成度和大功率方向发展,有力牵引了射频微系统技术的进步,同时给冷却设计带来三大挑战:高面热流度、热堆叠和高体热流密度。冷却技术成为制约射频微系统应用的关键瓶颈之一。文中综述了国内外当前射频微系统冷却技术的发展现状,传统的远程散热架构因界面多与传热路径远已难以为继,高集成度的近结冷却技术显著提升芯片散热能力;以有源相控阵雷达为例,提出了射频微系统冷却的三代技术路线,指出了射频微系统热设计的主要发展方向。

The development of radio frequency (RF) electronic equipment such as radar and electronic warfare has greatly impelled the progress of RF microsystem technology in the direction of high density integration and high power. At the same time, it brings three major challenges to thermal management: high heat flux, thermal stacking and high heat density. Cooling technology has become one of the key bottlenecks restricting the application of RF microsystems. This paper introduces the state of art on cooling requirements and provides a broad review of the cooling technologies for RF microsystems. The traditional remote cooling architecture becomes unsustainable due to high interface resistance and long heat transfer path. The highly integrated near-junction cooling technology significantly improves the chip′s cooling capacity. Three cooling technology routes for RF microsystems such as active electronically scanned radar is proposed, and the main developing direction of thermal designs for RF microsystems is indicated.

TN305.94