提高机械密封的性能和寿命对电子设备冷却系统具有重要意义。文中将上游泵送槽型结构应用于电子设备冷却系统机械密封中,并采用热-流固模型对不同工况参数和设计参数条件下的密封性能变化规律和机理进行了研究。结果表明:在一定的压力和转速范围内,所设计的槽型参数可以实现密封的非接触运转和零泄漏;弹簧比压变化和外槽螺旋角等设计参数对密封性能和工作状态影响显著,需选择合理区间。文中结果可为电子设备冷却系统机械密封的创新设计提供参考和依据。

Improving the performance and life of mechanical seals is of great significance to electronic equipment cooling systems. In this paper, the upstream pumping trough structure is applied to the mechanical seal of the electronic equipment cooling system, and the thermo-fluid-solid model is used to study the sealing performance change rules and mechanisms under different working conditions and design parameters. The results show that within a certain range of pressure and speed, the groove parameters designed in this paper can achieve non-contact operation and zero leakage of the seal. The design parameters such as the change of spring specific pressure and the spiral angle of the outer groove have a significant influence on the sealing performance and working state, and a reasonable interval needs to be selected. The results of this paper can provide a reference and basis for the innovative design of the mechanical seal of electronic equipment cooling system.

TN97.51