微系统三维异质异构集成技术是实现未来射频电子系统更高集成度、更高性能、更高工作频率等需求的最具前景的技术,文中对射频微系统集成技术在军民领域的应用需求及前景进行了分析,对其技术内涵及技术体系进行了系统性总结,阐释了微系统集成技术在满足系统工程化应用情况下在设计仿真、热管理、测试、工艺和可靠性等方面所面临的新挑战及其解决方案,同时提出了射频微系统集成技术的进一步发展思路。

The 3D heterogeneous integration technology is considered the most proposing technology for the future high density RF electronic system with the requirements of more integrated, better system performance, higher operating frequencies. In this paper, the application requirements and development trend of RF microsystem in military and civilian fields are demonstrated, and the connotation and architecture of 3D heterogeneous integration technology are summarized. Then the technical challenges and its solutions in design, thermal management, testing technology, integrated technique and reliability are predicted. In the end the further thinking of the integration technology is illustrated.

TN40