封装天线技术以天线与电路的极高度集成为特征,紧密地将微电子技术和三维微纳集成工艺结合在一起,切合了相控阵天线高频化、小型化和低成本的发展需求。文中概述了封装天线技术在毫米波相控阵天线中的应用前景及其技术内涵,同时结合系统形态和工艺梳理出毫米波相控阵封装天线的技术路线与关键技术,力图对其中涉及的封装架构、集成工艺、热管理、仿真和测试等方面进行阐述和总结,希望对毫米波相控阵封装天线的探索研究和工程化应用起到借鉴和推动作用。

With the use of micro-electronic technology and three-dimensional integration processing, Antenna-in-package (AiP) technology can embed antennas and circuits into an extremely confined package. The adoption of AiP technology within phased array antenna applications will surely accelerate its development and achieve systems with high frequency, small form factor and low cost. Prospective application scenarios are presented, as well as the concept and prerequisites of AiP technology. In this paper, technical routes are classified into ceramic, silicon, organic, and mixed types by the material used. Key techniques are stated and summarized, with respect to architecture, process, thermal management, simulation, and test. As a whole, this paper aims to provide valuable reference and promote the research and development of AiP technology for millimeter-wave phased array antenna applications.

TN305.94