随着高热耗高集成功率器件要求的提高,高效散热技术与微系统冷却的研究在不断推进。目前的微系统散热存在微细流道容杂质能力差、末端换热器体积大、系统散热效率低等问题。文中设计搭建了自循环冷却构架,研制出集成散热基板、微泵、微换热器的自循环微冷却系统原理样机,测试结果表明,该样机最高可实现热流密度500 W/ cm2 的芯片冷却。

With the improved requirements of high concentration for power devices, the research of high-efficiency cooling technology and microsystem cooling is advancing. The current microsystem cooling has problems of poor tolerance impurity ability in microflow channel, a large volume in final-stage heat exchanger, and low heat dissipation efficiency in system. A self-circulating cooling structure is designed and established. A prototype of the self-circulating micro-cooling system of integrated heat sink, micropump, and microheat exchanger is developed. The test results show that the chip cooling of 500 W/ cm2 can be achieved.

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