天线阵面是相控阵雷达系统的核心设备,包含成百上千个收发组件。传统的低功率收发通道包括大量的射频芯片和分立器件,电路复杂,系统可靠性低。基于先进微系统技术的射频系统级封装(SiP)尤其适用于相控阵雷达集成化、小型化的需求,也是掌握核心技术的关键。文中展示了一款自研生产的单通道射频收发SiP,分析了应用在数字收发组件时重要的装配互联问题,比较了不同封装形式对性能指标的影响,并研究了适用于收发组件的射频SiP 现状及技术发展途径。

Antenna array is the core equipment of phased array radar system, which includes hundreds of transceiver components. The traditional low-power transceiver channel includes a large number of radio frequency (RF) chips and discrete devices, with complex circuit and low system reliability. RF system in package (SIP) based on advanced micro system technology is especially suitable for phased array radar integration and miniaturization, which is also the key to master the core technology. A self-developed single channel RF transceiver SiP is presented, the important assembly interconnection problems when applied to digital transceiver components is analyzed, the effects of different packaging forms on performance indicators are compared, and the current situation and technical development path of RF SiP for transceiver components are studied.

TN958.52